Customized Disco Wafer Frame TJF-C-3
Product Introduction
Product Description
Customized Semiconductor Wafer Frame TJF-C for Cleanroom Applications
Wafer Frame / Dicing Ring
Specifically designed for semiconductor cleanroom environments, the TJF-C customized wafer frame works with adhesive tape to securely hold wafers during back-end processes, ensuring high precision in grinding and dicing operations.
Standard 6-inch, 8-inch, and 12-inch wafer frames are also available.
Key Features
✨ Premium Materials
Manufactured from high-quality 420 stainless steel. SGS tested and certified, compliant with ISO 9001 Quality Management System and SGS RoHS hazardous substance regulations—ensuring outstanding durability and reliability.
✨ Surface Finishing Options
Available in both polished (mirror) and matte finishes to meet diverse process requirements.
✨ Eco-Friendly & Cost-Effective
Reusable design with professional contract cleaning services available to extend product lifespan and reduce total operating costs.
✨ Comprehensive Customization
Fully customizable designs, including square, round, and other configurations, to meet the specific needs of different industries and applications.
✨ Advanced Surface Processing
Precision CNC machining and laser engraving for logos, batch numbers, dates, serial numbers, and more—providing flexible support for traceability and production management.
Our wafer frames are trusted by leading global semiconductor companies such as Amkor, ASE, KLA, TSMC, and ABB, among other industry leaders.
By choosing wafer frames manufactured by YJ Corevia, you gain both superior product quality and highly competitive professional cleaning services—your trusted partner in semiconductor manufacturing.
As long as you purchase YJ COREVIA’s Wafer Frame/Disco Ring,
✨you can enjoy the most favorable contract cleaning service!✨
→Wafer Frame Customized cleaning Services
