6 Inch Grip Ring / Wafer Expander Ring TJF-R6

6 Inch Grip Ring / Wafer Expander Ring TJF-R6

The 6 Inch Grip Ring, also known as a Wafer Expander Ring, is engineered for semiconductor and LED manufacturing processes requiring precise wafer expansion and stable fixation. Designed for cleanroom environments, this wafer expander ring ensures controlled wafer stretching during dicing and chip separation.

In addition to the 6-inch model, 8-inch and 12-inch wafer grip rings are also available to meet different wafer size requirements.

Grip Ring Key Features

• Precision Manufacturing
  Produced under strict tolerance control to ensure accurate wafer alignment, stable clamping, and consistent process performance.
• Strong & Lightweight Construction
  Made from fiber-reinforced polycarbonate, the grip ring offers high mechanical strength while maintaining a lightweight structure for easy handling.
• User-Friendly Identification Design
  Inner and outer ring notch markings allow quick orientation recognition, enabling faster and more precise positioning during operation.
• Wide Industry Applications
  Suitable for semiconductor fabrication, wafer processing, electronics manufacturing, chip production, and cleanroom operations.
• Cost-Effective & Durable
  Combines affordability with long service life, delivering excellent operational value.

Structural Design

The wafer expander ring consists of an inner ring and an outer ring. This structure securely holds the wafer while allowing uniform expansion after dicing, improving chip pick-up efficiency and reducing breakage risk. Multiple specifications are available to support diverse semiconductor process requirements.

Color availability depends on current stock.