12 Inch Grip Ring / Wafer Expander Ring TJF-R12

Product Description

12 Inch Grip Ring / Wafer Expander Ring TJF-R12

The 12 Inch Wafer Expander Ring, also known as a Grip Ring, is designed for advanced semiconductor and LED manufacturing processes that require precise wafer expansion and stable clamping. Built for cleanroom environments, this wafer expander ring ensures uniform wafer stretching during dicing, improving chip separation efficiency and reducing breakage risk.

6-inch and 8-inch expander ring models are also available to support various wafer sizes and process needs.

Key Features

• High-Precision Manufacturing
  Produced under strict tolerance control to ensure accurate wafer alignment, consistent clamping force, and stable performance during semiconductor back-end operations.
• Strong & Lightweight Construction
  Manufactured from fiber-reinforced polycarbonate, the grip ring combines high mechanical strength with lightweight handling, making it suitable for both automated and manual processes.
• Easy Identification & Positioning
  Inner and outer ring notch markings allow quick orientation recognition, improving setup efficiency and reducing handling errors.
• Wide Industry Applications
  Suitable for semiconductor fabrication, wafer processing, LED production, electronics manufacturing, chip packaging, and cleanroom environments.
• Cost-Effective & Durable
  Designed for long-term durability while maintaining competitive cost efficiency for high-volume production.

Structural Design

The 12 inch wafer expander ring features a dual-ring structure consisting of an inner and outer ring. This design securely holds the wafer in place while enabling controlled expansion after dicing, supporting precise chip pick-up and minimizing edge damage.

Color availability depends on current stock.