8 Inch Grip Ring / Wafer Expander Ring TJF-R8
The 8 Inch Grip Ring, also referred to as a Wafer Expander Ring, is built to deliver stable and consistent wafer expansion in semiconductor and LED production environments. Designed for cleanroom use, this expander ring ensures secure wafer clamping during dicing, helping improve chip separation accuracy and overall process yield.
Additional sizes, including 6-inch and 12-inch wafer grip rings, are available to support a full range of semiconductor manufacturing requirements.
Key Features
- Accurate & Stable Performance
Manufactured with tight tolerance control to ensure precise wafer positioning and uniform expansion during back-end processing. - Durable Yet Lightweight Material
Constructed from fiber-reinforced polycarbonate, providing high strength, dimensional stability, and easy handling in automated or manual operations. - Efficient Orientation Design
Integrated notch markings on the inner and outer rings allow fast identification and correct positioning, reducing setup time. - Versatile Application
Widely used in semiconductor fabrication, LED chip production, wafer processing, electronics manufacturing, and cleanroom operations. - Reliable & Economical Solution
Engineered for long service life while maintaining cost efficiency for high-volume production environments.
Functional Structure
The 8 inch wafer expander ring features a dual-ring design consisting of an inner and outer ring. This structure securely holds the wafer in place while enabling controlled expansion after dicing, improving chip pick-and-place efficiency and minimizing edge damage.
Color options depend on current stock availability.
