Wafer Frame/Metal Frame

YJ Corevia provides high-performance wafer frame, dicing ring, wafer ring, grip ring, and disco wafer frame solutions designed for advanced semiconductor manufacturing. Our wafer frames are widely preferred by semiconductor manufacturers for their ergonomic structure, lightweight design, and reliable mechanical strength. Each metal wafer frame and disco wafer frame delivers stable wafer support during shipping, storage, and high-precision processing, ensuring maximum protection at every stage.

Our dicing ring, wafer ring, and grip ring products are engineered to provide secure clamping and accurate wafer positioning during dicing and expansion processes. This helps minimize wafer movement, reduce contamination risks, and maintain consistent production quality in cleanroom environments.

YJ Corevia proudly serves leading semiconductor companies worldwide, including TSMC, SONY, Amkor, ASE, ChipMOS, SPIL, and GREATEK. Through trusted trading partners, our products are supplied to major markets such as the United States, Japan, Germany, Thailand, and Singapore.

We offer a complete range of metal wafer frames, disco wafer frame, dicing ring, wafer ring, and grip ring products in all standard industry sizes. Custom dimensions, materials, and specifications are available to meet the evolving requirements of semiconductor packaging, wafer dicing, and advanced chip manufacturing applications.