6 Inch Metal Film Frame | Wafer Frame | TJF-6A

6 Inch Metal Film Frame | Wafer Frame | TJF-6A

The 6 inch metal film frame TJF-6A is a precision-engineered metal film frame designed for high-accuracy wafer handling in semiconductor cleanroom environments. Also known as a wafer frame, wafer ring, dicing ring, or disco wafer frame, this metal film frame securely supports wafers with adhesive tape during back-end processes such as grinding and dicing, ensuring stable positioning and improved process accuracy.

In addition to the 6-inch model, YJ Corevia provides 8-inch, 12-inch, and fully customized metal film frame and wafer frame solutions to meet diverse semiconductor manufacturing requirements.

High-Precision Metal Film Frame for Semiconductor Processing

This metal film frame is designed to maintain wafer flatness and stability during critical processes. Its rigid structure minimizes vibration, reduces misalignment risk, and helps improve yield and process consistency in semiconductor production.

Key Features of Metal Film Frame

• 420 Stainless Steel Construction
  High-strength 420 stainless steel ensures excellent durability, wear resistance, and dimensional stability. SGS tested and compliant with ISO 9001 and RoHS standards.
• Surface Finishing Options
  Available in polished (mirror) and matte finishes to meet different cleanroom and contamination control requirements.
• Reusable & Cost-Efficient Design
  Designed for multiple production cycles, with optional cleaning services to extend lifespan and reduce operational costs.
• Customizable Metal Film Frame Solutions
  Supports round, square, and special-shaped designs to match specific semiconductor equipment and process requirements.
• Precision CNC Machining
  Ensures tight tolerances and consistent quality for high-precision wafer handling applications.
• Laser Engraving & Traceability
  Enables marking of logos, serial numbers, batch codes, and dates to improve production tracking and asset management.

Applications of Metal Film Frame

The TJF-6A metal film frame is widely used in:

• Wafer dicing
• Wafer grinding
• Semiconductor back-end processes
• Cleanroom wafer handling
• Advanced packaging and IC manufacturing

This metal film frame provides a reliable and contamination-controlled solution for high-precision semiconductor environments.

Trusted Metal Film Frame Manufacturer

YJ Corevia’s metal film frame, wafer frame, dicing ring, and wafer ring products are trusted by leading semiconductor companies, including Amkor Technology, ASE Technology, KLA Corporation, TSMC, and ABB, demonstrating proven performance in high-volume production environments.

Customers who purchase YJ Corevia metal film frame or wafer frame products can also benefit from our competitive contract wafer frame cleaning services, making YJ Corevia your reliable partner in semiconductor manufacturing.