12 Inch Plastic Wafer Frames TJF-12P-2.5
Width 380mm
Outer Diameter Ø400mm
Inside Diameter Ø350mm
Product Introduction
Product Description
12-Inch Plastic Wafer Frame TJF-12P-2.5 for Semiconductor Cleanroom Applications
Plastic Wafer Frame / Plastic Dicing Ring / Tape Frame
Designed for semiconductor cleanroom environments, the TJF-12P-2.5 plastic wafer frame is manufactured from PPS material, offering a lightweight yet durable solution for wafer handling and support.
6-inch and 8-inch plastic wafer frames are also available.
Product Features
✨ Lightweight & Durable Material
Made from PPS plastic, providing excellent strength, durability, and ease of handling.
✨ Industry-Specific Application
Ideal for use in semiconductor manufacturing, wafer processing, electronics industries, cleanroom environments, and chip packaging operations.
✨ Stable Support for Back-End Processes
The 6-inch frame is designed for back-end packaging processes, providing secure outer-frame support during wafer grinding and dicing operations.
Additional Options
✨ Material & Processing Flexibility
In addition to plastic wafer frames, 6-inch stainless steel wafer frames are also available.
CNC machining and laser engraving for logos, batch numbers, dates, serial numbers, and other identifiers can be customized to support efficient process control and traceability.
Globally Trusted
Our wafer frames are trusted by leading global semiconductor companies, including Amkor, ASE, KLA, TSMC, and ABB, among other industry leaders.
📌 Applications
Semiconductor back-end processes, providing secure wafer support and fixation during grinding and dicing operations.
