Customized Disco Wafer Frame TJF-C-3
Product Introduction
Product Description
Customized Disco Wafer Frame TJF-C-3
The Customized Disco Wafer Frame TJF-C-3 is engineered for semiconductor cleanroom environments that require precision wafer fixation and stable back-end processing. Designed to work with adhesive tape, this disco wafer frame securely holds wafers during grinding and dicing operations, ensuring accurate alignment, reduced vibration, and consistent processing quality.
In addition to customized disco wafer frames, YJ Corevia also provides standard 6-inch, 8-inch, and 12-inch wafer frames to support a wide range of semiconductor manufacturing applications.
Key Features
- Premium 420 Stainless Steel Construction
Manufactured from high-quality 420 stainless steel, offering superior rigidity, durability, and long-term reliability. SGS tested and compliant with ISO 9001 and RoHS standards. - Surface Finishing Options
Available in polished (mirror) and matte finishes to meet various cleanroom and process requirements. - Reusable & Cost-Effective Design
Built for repeated use, with professional wafer frame cleaning services available to extend product lifespan and reduce total operating costs. - Comprehensive Customization
Fully customizable disco wafer frame designs, including square, round, and special configurations tailored to specific equipment and semiconductor process needs. - Advanced CNC & Laser Engraving
Precision CNC machining and laser engraving for logos, serial numbers, batch codes, and manufacturing dates enhance traceability and production control.
Globally Trusted Performance
YJ Corevia wafer frames are trusted by leading semiconductor companies such as Amkor, ASE, KLA, TSMC, and ABB.
By choosing YJ Corevia’s Customized Disco Wafer Frame and Disco Ring solutions, customers benefit from premium manufacturing quality and competitive contract cleaning services.
→ Wafer Frame Customized Cleaning Services
