Grooved Wafer Frame TJF-C-2
Product Introduction
Product Description
Grooved Wafer Frame TJF-C-2
The Grooved Wafer Frame TJF-C-2 is engineered for semiconductor cleanroom environments requiring enhanced wafer stability during back-end processes. Designed to work with adhesive tape, this customized grooved wafer frame securely holds wafers in place, improving alignment and ensuring high precision during grinding and dicing operations. The grooved structure provides optimized positioning and additional support, helping reduce vibration and minimize wafer edge damage.
In addition to the grooved design, YJ Corevia also supplies standard 6-inch, 8-inch, and 12-inch wafer frames to meet diverse semiconductor manufacturing requirements.
Key Features
- Premium 420 Stainless Steel Construction
Manufactured from high-quality 420 stainless steel, delivering superior rigidity, durability, and long-term performance. SGS tested and compliant with ISO 9001 and RoHS standards. - Surface Finishing Options
Available in polished (mirror) or matte finishes to meet different cleanroom and process specifications. - Reusable & Cost-Effective Design
Built for repeated use, with professional wafer frame cleaning services available to extend product lifespan and reduce operating costs. - Comprehensive Customization
Supports square, round, grooved, and other customized configurations tailored to specific semiconductor equipment and applications. - Advanced CNC & Laser Engraving
Precision machining and laser engraving for logos, serial numbers, batch codes, and dates enhance traceability and production management.
Globally Trusted Quality
YJ Corevia wafer frames are trusted by leading semiconductor companies including Amkor, ASE, KLA, TSMC, and ABB.
By choosing YJ Corevia’s Grooved Wafer Frame and Disco Ring solutions, customers benefit from premium product quality and competitive contract wafer ring cleaning services, making YJ Corevia a dependable partner in advanced semiconductor manufacturing.
