Wafer FOUP | Wafer SMIF Pod / Tape Frame FOUP (12 Inch) TJF-U12-25S
(L)370*(W)387(H)322 mm
Product Introduction
Product Description
Wafer FOUP | Wafer SMIF Pod / Tape Frame FOUP (12 Inch) TJF-U12-25S
The Wafer FOUP TJF-U12-25S (12 Inch, 25 Slot) is a high-performance Wafer FOUP designed to meet SEMI E47.1 standards for advanced semiconductor manufacturing. This integrated Wafer FOUP / Wafer SMIF Pod / Tape Frame FOUP solution provides secure storage, transportation, and handling of 12-inch wafers, thin substrates, and tape frames in cleanroom environments.
Engineered for high-precision wafer handling, this Wafer FOUP ensures stable transfer between process tools while minimizing particle contamination, electrostatic discharge (ESD), and mechanical impact—helping improve yield and process reliability in semiconductor fabs.
Advanced Wafer FOUP Design｜Cleanroom & Automation Ready
The Wafer FOUP TJF-U12-25S features a front-opening unified pod structure, making it fully compatible with automated handling systems (AMHS) used in semiconductor fabrication plants.
- Front-Opening Design with Viewing Window
Enables efficient wafer access while maintaining cleanroom integrity. The transparent window allows quick inspection without opening the FOUP, reducing contamination risk. - Anti-Static Protection (ESD Control)
Built with anti-static materials to minimize microparticle attraction and prevent electrostatic damage, ensuring stable wafer quality. - Flexible Compatibility
This Wafer FOUP / Wafer SMIF Pod / Tape Frame FOUP supports 12-inch wafers, square chips, thin substrates, and tape frames. Optional RFID integration enables real-time tracking and smart factory (MES) integration.
Wafer FOUP Key Advantages
- SEMI E47.1 compliant Wafer FOUP for fab-level compatibility
- Integrated Wafer SMIF Pod functionality for contamination control
- Multi-purpose Tape Frame FOUP for flexible applications
- High structural stability for secure wafer transport
- Cleanroom-compatible design for advanced semiconductor environments
- Supports automation, traceability, and smart manufacturing
Applications｜Wafer FOUP in Semiconductor Industry
- Semiconductor wafer fabrication (Fab)
- Cleanroom wafer storage and transport
- Automated wafer handling systems (AMHS)
- Backend packaging and tape frame processes
- Microelectronics and advanced materials manufacturing
High-Performance Wafer FOUP Solution
The Wafer FOUP TJF-U12-25S is widely adopted in semiconductor fabs and microelectronics facilities, delivering reliable wafer protection and efficient logistics. By combining Wafer FOUP, Wafer SMIF Pod, and Tape Frame FOUP functionalities, it supports high-yield production, contamination control, and long-term operational stability.
If you are looking for a reliable Wafer FOUP manufacturer or Wafer SMIF Pod supplier, YJ Corevia provides high-quality, cleanroom-compliant solutions tailored for advanced semiconductor applications.